演講主題 :
「Thermal, Electromagnetic, and Failure Analysis of Advanced Microelectronic Devices」

Shrinking features and growing device complexity in today’s advanced devices have led to increased challenges in characterizing the thermal behavior and failure of these devices. With higher power densities, having a full understanding of the static and dynamic thermal behavior of the devices is essential for ensuring optimal trade-offs between performance and device reliability. With sub-micron devices, high spatial and temporal resolutions are required. In this presentation, some of the latest techniques of thermal analysis will be described and compared. Two popular non-contacting techniques will be dealt with in greater detail.
First, It was found that thermo-reflectance thermography can best meet the challenges imposed by these advanced devices by providing sub-micron spatial resolution and temporal resolution in the picosecond range. Hot spots generates when failures occur in a device. Thermal analysis can determine the location of hot spots and hence aid in the failure analysis of device. It can also help to characterize the thermal behavior, thermal properties, and the thickness of thin films in the device in situ and non-destructively.
Second, Using a novel quantum spin crossover (SCO) material, electromagnetic power intensity can be correlated with temperature. Hence, via SCO coating, a thermal imaging system can be adapted to characterize the electromagnetic power intensity field of antennas in a much quicker and cheaper manner than current methods. Several case studies will be presented.

Bio of Dr. Andrew Tay :
Prof. Andrew Tay is currently an Adjunct Professor in the Department of Electrical and Computer Engineering, National University of Singapore (NUS) and a
Visiting Scientist at the Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), NUS. Prior to this he was a Professor of Mechanical Engineering at NUS. He obtained his B.E. (Hons I and University Medal) and Ph. D in Mechanical Engineering from the University of New South Wales, Australia. His research interests include electronics packaging (thermo-mechanical failures,delamination, effects of moisture, solder joint reliability), thermal management of electronic systems and EV batteries, infrared and thermo-reflectance thermography, solar photovoltaics reliability, and fracture mechanics.
He is currently a member of the Board of Governors of the IEEE Electronics
Packaging Society (EPS), the EPS Director of Chapter Programs, and a Distinguished Lecturer of EPS. He was the inaugural General Chair of the 1st Electronics Packaging Technology Conference (EPTC) in 1997 and currently the Chairman of the EPTC Board.
- 2019 IEEE EPS David Feldman Outstanding Contribution Award
- 2012 IEEE CPMT Exceptional Technical Achievement Award
- 2012 IEEE CPMT Regional Contributions Award
- 2004 ASME EPPD Engineering Mechanics Award
- 2000 IEEE Third Millennium Medal
- Fellow of ASME and Life Fellow of IEEE