國立台灣大學

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濺鍍及蒸鍍銀奈米孿晶薄膜及其在3D-IC與功率IC產品的應用(點此連結PDF)

　

科技部工程司產學合作計畫研究優良成果 - 抗離子遷移銀合金銲線開發 (點此連結PDF)

　

 

　

圖片4圖片8     

 

 

圖片8POSTER 4-2R&D100 HIGH AG ALLOY

 

 

 

研究成果

歷年發表SCI期刊論文198篇，發明專利82件(國內45件，國外37件)，專書4冊。

　

近五年(2016-2020)期刊論文目錄:

1.                  C.H. Tsai, C.H. Chuang, H.H. Tsai, J.D. Lee, Dennis Chang, H.J. Lin, and T.H. Chuang, 2016, “Materials Characteristics of Ag-alloy Wires and their Applications in Advanced Packages”, IEEE Trans. Compon. Packag. Manufact. Technolog., 6, 2, 298-305, U.S.A.

2.                  S.C.Chen, C.H. Wang, H. Sun, C.K. Wen, C.F. Lu, C.L. Tsai, Y.K. Fu, and T.H. Chuang, 2016, “Microstructure, Electrical and Magnetic Properties of (Ga, Co)-ZnO Films by Radio Frequency Magnetron Co-Sputtering”, Surface and Coatings Technology, 303, 203-208.

3.                  Y.C. Lin, K.T. Lee, J.D. Hwang, H.S. Chu, C.C. Hsu, S.C. Chen, and T.H. Chuang, 2016,” Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Materials with Cu Electrodes”, J. Electronic. Mater., 45, 10, 4935-4942.

4.                  Y.C. Lin, C.L. Yang, J.Y. Huang, C.C. Jain, J.D. Hwang, H.S. Chu, S.C. Chen, and T.H. Chuang, 2016,” Low Temperature Bonding of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrodes using a Thin-Film In Interlayer” Metall. Mater. Trans., 47A, 4767-4776.

5.                  H.Sun, C.K. Wen, S.C. Chen, T.H. Chuang, M.A.P. Yazdi, F. Sanchette, and A. Billard, 2016, “Microstructures and Optoelectronic Properties of CuxO Films Deposited by High-Power Impulse Magnetron Sputtering”, J. Alloy Compounds, 688, 672-678.

6.                  H. Sun, S.C. Chen, C.K. Wen, T.H. Chuang, M.A.P. Yazdi, F. Sanchette, and A. Billard, 2017, “P-type Cuprous Oxide Thin Films with High Conductivity Deposited by High Power Impulse Magnetron Sputtering”, Ceramics International, 43, 6214-6220.

7.                  S.L. Ou, S.C. Chen, Y.C. Lin, P.C. Lin, C.K. Wen, and T.H. Chuang, 2017, “Characterization and Crystallization Kinetics of Sputtered NiSi Thin Films for Blue Laser Optical Recording Application”, Vacuum, 140, 144-148.

8.                  H. Sun, S.C. Chen, S.W. Hsu, C.K. Wen, T.H. Chuang, and X. Wang, 2017, “Microstructures and Optoelectronic Properties of Nickel Oxide Films Deposited by Reactive Magnetron Sputtering at Various Pressures of Oxygen Environment”, Ceramics International, 43, S369-S375.

9.                  S.L Cheng, T.H. Chuang, and J.G. Lin, 2017, “Spin Diffusion Length in Ferromagnet/Superconductor Bilayers”, IEEE Trans. Magnetics, 53, 11, P. 9000104.

10.              C.H. Chen, Y.C. Lin, Y.T. Shih, S.C. Chen, C.H. Tsai, S.C. Wang, and T.H. Chuang, 2018, “Evaluation of Corrosion Resistance of Ag-alloy Bonding Wires for Electronic Packaging”, IEEE Trans. Compon. Packag. Manufact. Technolog., 8,1, 146-153.

11.              Y.C. Lin, C.H. Chen, Y.Z. He, S.C. Chen, and T.H. Chuang, 2018, “Electrolytic Migration of Ag-Pd Alloy Wires with various Pd Contents”, J. Electronic. Mater., 47, 7, 3634-3638.

12.              L.W. Chen, C.Wang, Y.C. Liao, C.L. Li, T.H. Chuang, and C.H. Hsueh, 2018, “Design of Diffusion Barrier and Buffer Layers for β-Zn4Sb3 Mid-temperature Thermoelectric Modules”, J. Alloy Compounds, 762, 631-636.

13.              T.H. Chuang and C.H. Chen, 2018, “Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wores”, Metall. Mater. Trans., 49A, 5904-5910.

14.              H. Sun, S.C. Chen, W.C. Peng, C.K. Wen, X. Wang, and T.H. Chuang, 2018 “The Influence of Oxygen Flow Ratio on the Optoelectronic Properties of P-Type NiOx Films Deposited by Ion Beam Assisted Sputtering”, Coatings, (2018) 8, 168; doi: 10.3390/coatings 8050168.

15.              C. K. Wen, Y.Q. Xin, S. C. Chen, T.H. Chuang, P.J. Chen, and H. Sun, 2019, “Comparison of Microstructure and Optoelectronic Properties of NiO : Cu Thin Films Deposited by Ion Beam Assisted RF Sputtering in Different Gas Atmospheres”, Thin Solid Films, 677, 103-108.

16.              Y.C.Lin, C.H. Chen*, J.H. Yuan, Y.K. Sun, K.Y. Chiu,P.Y. Lee, W.H. Chang, and T.H. Chuang, 2019, “Isothermal Solidification Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes”, Eng. & Technology Res., 3 (3) Feb. on line.

17.              H. Sun, S.C. Chen, C.K. Wen, Y.W. Lin, C.K. Wen, T.H. Chuang, X. Wang, S.S. Lin, and M.J. Dai, 2019, “Electrical and Magnetic Properties of (Al, Co) co-doped ZnO Films deposited by RF Magnetron Sputtering”, Surface and Coating Technology, 359, 390-395.

18.              B.H. Kuo, D.C. Tsai, Y.L. Huang, P.C. Hsu, T. H. Chuang, J.D. Lee, H.H. Tsai, H. Tsai, L. Huang, and F.S. Shieu, 2019, “Effect of Alloying Au on the Microstructure, Mechanical and Electrical Properties of Ag-based Alloy Wires”, J. Materials Science: Materials in Electronics, 30: 9396-9409.

19.              J.H. Yuan and T.H. Chuang, 2019, “Luminous Efficiency of Pd-doped Ag-alloy Wire Bonded LED Package after Reliability Tests”, Mater. Sci. Forum, 960, 221-230.

20.              S.L. Cheng, C.H. Du, T.H. Chuang, and J.G. Lin, 2019, “Atomic Replacement Effects on the Band Structure of Doped Perovskite Thin Films”, Scientific Reposts, (2019) 9:7828/10.1038/s41598-019-44104-7.

21.              B.H. Kuo, P.C. Hsu, J.D. Lee, F.S. Shieu, H.H. Tsai, H. Tsai, Y.L. Huang, D.C. Tsai, and T.H. Chuang,and 2019,“Au-induced Improvements in the Grain Stability and Mechanical Properties of Ag-based Alloy Wires under Electrical Current Stressing”, J. Materials Science: Materials in Electronics, accepted.

22.              Y.J. Wu, S.C. Hsu, Y.C. Lin, Y. Xu, T.H. Chuang, and S.C. Chen, “Study on thermoelectric Property Optimization of Mixed-phase Bismuth Telluride Thin Films Deposited by Co-evaporation Process”, Surface & Coatings Technology, on line (2020).

23.              T.H. Chuang, S.W. Hsu, Y.C. Lin, W.T. Yeh, C.H. Chen, P.I. Lee, P.C. Wu, and H.P. Cheng, 2020” Improvement of Sn-3Ag-0.5Cu soldered joints between Bi0.5Sb1.5Te3 thermoelectric material and a Cu electrode, J. Electro. Mater., 49, 2 (2020) 3391-3399.

24.              J.H. Yuan and T.H. Chuang, 2020, “Lumen Maintance of Ternary Ag-alloy Bonded LED Package after Reliability Tests”, Mater. Sci. Forum, accepted.

25.              J.H. Yuan and T.H. Chuang, 2020, “Bondability of Pd and Au Containing Ag- alloy Wires on Au Pads for LED Package”, IEEE Trans. Compon. Packag. Manufact. Technolog., accepted.

26.               C.H. Chen, Y.C. Lin, A. Groth, Y.C. Lai, C.Y. Lin, H.M. Chang, Tung-Han Chuang, 2020, “Ultrasonic Bonding of Ag and Ag-alloy Ribbon – an innovative alternative for High Power IC Packages”, IEEE Trans. Compon. Packag. Manufact. Technolog., accepted.

27.              T.H. Chuang, P.C. Wu, Y.C. Lai, and Yan-Cheng Lin, 2020, “Deposition of (111)-Oriented Ag Nano-twinned Film on (111) Si Wafer”, Int. J. Mining, Mater. And Metall. Eng., accepted.

28.              C.H. Chen, J. Hoffer, Y.C. Lin, C.Y. Lin, and T.H. Chuang, Cu/Al clad and Ag-4Pd ribbon bonding for high power IC packages, Sensor & Transducer, 2020, accepted.

29.              S. L. Cheng, T. H. Chuang and J.G. Lin, “Great Enhancement of Band Gap Via Atomic Replacement in Doped Perovskite Thin Film”, Applied Physics Letters, submitted.

30.               S.C. Chen, H. Sun, C.H. Wang, S.Y. Huang, C.K. Wen, T.H. Chuang”,

Microstructures and Perpendicular Magnetic Properties of Co80Pt20/Ru/Ag Multilayer Films”, Trans. Magnetics, submitted.

31.               S.C. Chen, J.Y. Hong, J.H. Zhen, Y.W. Lin, S.C. Hsu, and T.H. Chuang,” Microstructure and Electrical Properties of Zn-Sb Alloy Films Deposited by Ion Beam Assisted RF Sputtering”, Surface and Coating, submitted.

32.               T.H. Chuang, C.K. Wen, M.H. Liao, F. Liu, H. Sun, S.C. Chen,”P-type semi-transparent conductive NiO films with high deposition rate produced by superimposed hifh power impulse magnetron sputtering”, J. European Ceramic Society, submitted.

33.              T.H. Chuang, P.C. Wu, Y.C. Lai, P.I. Lee, and J. Chou, “Effect of Ti adhesive layer on epitaxial growth of Ag nanotwinned films on Si (100) “IEEE Trans. Compon. Packag. Manufact. Technolog.,submitted.

34.              S.C. Hsu, J.Y. Hong, C.L. Chen, S.C. Chen, J. H. Zhen, Y. Y. Chen, and T.H. Chuang, “The structures and thermoelectric properties of Zn-Sb alloy films fabricated by electron beam evaporation through an ion beam assisted deposition”, Appl. Surface Science, submitted.

35.              T.H. Chuang, P.C. Wu and Y.C. Lin, “Lattice buffer effect of Ti film on the epitaxial growth of Ag nanotwins on Si substrates with various orientations”, Mater. Character., submitted.

            T.H. Chuang, Y.C. Lin, and P.I. Lee, “Dendrite growth during ion migration between Ag-alloy wire couple in pure water under current stressing”, J. Alloy Compounds, submitted.

大型技術移轉:6件，技術移轉金:6,048,684元

1.       「高可靠度熱電模組封裝技術」經由科技部技轉中國鋼鐵股份有限公司，技轉權利金450,000元。

2.       「高功率模組封裝銀合金銲線開發」經由科技部技轉樂金股份有限公司，技轉權利金273,684元。

3.       「超微細錫球製作與覆晶植球技術」經由國科會技轉昇貿科技公司，技轉權利金3,500,000元。

4.       「添加稀土元素無鉛銲錫產品製程技術」，經由台灣大學技轉昇貿科技公司，技轉權利金160,000元。

5.       防電磁波干擾電腦外殻應用」 經由國科會技轉富驊企業公司，技轉權利金 1,215,000元。

6.       「抗離子遷移銀合金銲線開發」，經由科技部技轉樂金股份有限公司，技轉權利金450,000元。